About this item

3% Silver (SAC305) formula
No Clean Flux (Residues are Non-corrosive, Non-conductive)
Easily Dispensed
Excellent Wettability
Ideal for surface mount applications

Brand	MG Chemicals
Item Volume	25 Milliliters
Sterility Rating	SAC305
Unit Count	1 Each

Product details

Product Dimensions ‏ : ‎ 1.97 x 0.79 x 7.87 inches; 0.88 Ounces
Item model number ‏ : ‎ 4900P-25G
Date First Available ‏ : ‎ July 22, 2014
Manufacturer ‏ : ‎ MG CHEMICALS

Product Description

MG Chemicals has developed a unique flux system designed specifically for high temperature Unleaded alloys. It provides the fluxing activity levels that promote thermal stability and prevents thermal degradation when reflowing under air atmosphere (normal). Since use of nitrogen is not required, MG 4900P Unleaded Solder paste will provide excellent cost savings.
In addition, MG 4900P Unleaded solder paste exhibits superior joint strength, excellent wettability, and extraordinary print definition and tack life. The post soldering residues of MG 4900P are non-conductive, non-corrosive and highly insulated.

Important information

From the manufacturer

4900P—SAC305 No Clean Solder Paste

Formulated for extreme flux activity and enhanced printing characteristics needed for ultra-fine pitch applications. It provides excellent wetting on copper OSP-coatings. Wide reflow process windows combined with high thermal stability yield solder joints with smooth surfaces. Available in a 25 g syringe and 250 g jar.

{getProduct} $button={Buy Now} $price={$33.95} $sale={35% Off} $icon={paypal} $style={1}

MG Chemicals 4900P SAC305, Lead Free Solder Paste, No Clean, 25 g (0.9 oz)